JPS6382953U - - Google Patents
Info
- Publication number
- JPS6382953U JPS6382953U JP1986177720U JP17772086U JPS6382953U JP S6382953 U JPS6382953 U JP S6382953U JP 1986177720 U JP1986177720 U JP 1986177720U JP 17772086 U JP17772086 U JP 17772086U JP S6382953 U JPS6382953 U JP S6382953U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- wiring layer
- interlayer insulating
- integrated circuit
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986177720U JPS6382953U (enExample) | 1986-11-19 | 1986-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986177720U JPS6382953U (enExample) | 1986-11-19 | 1986-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6382953U true JPS6382953U (enExample) | 1988-05-31 |
Family
ID=31119188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986177720U Pending JPS6382953U (enExample) | 1986-11-19 | 1986-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6382953U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018117111A1 (ja) * | 2016-12-21 | 2018-06-28 | 大日本印刷株式会社 | 貫通電極基板、半導体装置及び貫通電極基板の製造方法 |
-
1986
- 1986-11-19 JP JP1986177720U patent/JPS6382953U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018117111A1 (ja) * | 2016-12-21 | 2018-06-28 | 大日本印刷株式会社 | 貫通電極基板、半導体装置及び貫通電極基板の製造方法 |
| JP6380726B1 (ja) * | 2016-12-21 | 2018-08-29 | 大日本印刷株式会社 | 貫通電極基板、半導体装置及び貫通電極基板の製造方法 |
| US10950533B2 (en) | 2016-12-21 | 2021-03-16 | Dai Nippon Printing Co., Ltd. | Through electrode substrate and semiconductor device |
| US11742273B2 (en) | 2016-12-21 | 2023-08-29 | Dai Nippon Printing Co., Ltd. | Through electrode substrate and semiconductor device |
| US12136591B2 (en) | 2016-12-21 | 2024-11-05 | Dai Nippon Printing Co., Ltd. | Through electrode substrate and semiconductor device |