JPS6364035U - - Google Patents
Info
- Publication number
- JPS6364035U JPS6364035U JP1986158925U JP15892586U JPS6364035U JP S6364035 U JPS6364035 U JP S6364035U JP 1986158925 U JP1986158925 U JP 1986158925U JP 15892586 U JP15892586 U JP 15892586U JP S6364035 U JPS6364035 U JP S6364035U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- film
- view
- utility
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W72/07551—
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- H10W72/07553—
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- H10W72/50—
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- H10W72/531—
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- H10W72/536—
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- H10W72/59—
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- H10W72/934—
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- H10W72/983—
Landscapes
- Electrodes Of Semiconductors (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986158925U JPS6364035U (enExample) | 1986-10-16 | 1986-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986158925U JPS6364035U (enExample) | 1986-10-16 | 1986-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6364035U true JPS6364035U (enExample) | 1988-04-27 |
Family
ID=31082874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986158925U Pending JPS6364035U (enExample) | 1986-10-16 | 1986-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6364035U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017041566A (ja) * | 2015-08-20 | 2017-02-23 | セイコーエプソン株式会社 | 半導体装置及びその製造方法、電子機器並びに移動体 |
| JPWO2021240748A1 (enExample) * | 2020-05-28 | 2021-12-02 |
-
1986
- 1986-10-16 JP JP1986158925U patent/JPS6364035U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017041566A (ja) * | 2015-08-20 | 2017-02-23 | セイコーエプソン株式会社 | 半導体装置及びその製造方法、電子機器並びに移動体 |
| CN106469659A (zh) * | 2015-08-20 | 2017-03-01 | 精工爱普生株式会社 | 半导体装置及其制造方法、电子设备以及移动体 |
| CN106469659B (zh) * | 2015-08-20 | 2021-08-10 | 精工爱普生株式会社 | 半导体装置及其制造方法、电子设备以及移动体 |
| JPWO2021240748A1 (enExample) * | 2020-05-28 | 2021-12-02 | ||
| WO2021240748A1 (ja) * | 2020-05-28 | 2021-12-02 | 三菱電機株式会社 | 半導体装置およびその製造方法ならびに電力変換装置 |