JPH0265339U - - Google Patents

Info

Publication number
JPH0265339U
JPH0265339U JP1988144887U JP14488788U JPH0265339U JP H0265339 U JPH0265339 U JP H0265339U JP 1988144887 U JP1988144887 U JP 1988144887U JP 14488788 U JP14488788 U JP 14488788U JP H0265339 U JPH0265339 U JP H0265339U
Authority
JP
Japan
Prior art keywords
electrode
pads
wiring board
semiconductor chip
connection structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988144887U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988144887U priority Critical patent/JPH0265339U/ja
Publication of JPH0265339U publication Critical patent/JPH0265339U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/50
    • H10W72/07551
    • H10W72/07554
    • H10W72/5445
    • H10W72/547
    • H10W72/932

Landscapes

  • Wire Bonding (AREA)
JP1988144887U 1988-11-08 1988-11-08 Pending JPH0265339U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988144887U JPH0265339U (enExample) 1988-11-08 1988-11-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988144887U JPH0265339U (enExample) 1988-11-08 1988-11-08

Publications (1)

Publication Number Publication Date
JPH0265339U true JPH0265339U (enExample) 1990-05-16

Family

ID=31412991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988144887U Pending JPH0265339U (enExample) 1988-11-08 1988-11-08

Country Status (1)

Country Link
JP (1) JPH0265339U (enExample)

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