JPS63165846U - - Google Patents
Info
- Publication number
- JPS63165846U JPS63165846U JP1987058381U JP5838187U JPS63165846U JP S63165846 U JPS63165846 U JP S63165846U JP 1987058381 U JP1987058381 U JP 1987058381U JP 5838187 U JP5838187 U JP 5838187U JP S63165846 U JPS63165846 U JP S63165846U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- attached
- lead frame
- tab
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987058381U JP2524967Y2 (ja) | 1987-04-17 | 1987-04-17 | ワイヤボンデイング実装体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987058381U JP2524967Y2 (ja) | 1987-04-17 | 1987-04-17 | ワイヤボンデイング実装体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63165846U true JPS63165846U (enExample) | 1988-10-28 |
| JP2524967Y2 JP2524967Y2 (ja) | 1997-02-05 |
Family
ID=30888901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987058381U Expired - Lifetime JP2524967Y2 (ja) | 1987-04-17 | 1987-04-17 | ワイヤボンデイング実装体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2524967Y2 (enExample) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53105970A (en) * | 1977-02-28 | 1978-09-14 | Hitachi Ltd | Assembling method for semiconductor device |
| JPS58143541A (ja) * | 1982-02-22 | 1983-08-26 | Hitachi Ltd | 半導体装置 |
| JPS622626A (ja) * | 1985-06-28 | 1987-01-08 | Nec Corp | 半導体装置 |
-
1987
- 1987-04-17 JP JP1987058381U patent/JP2524967Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53105970A (en) * | 1977-02-28 | 1978-09-14 | Hitachi Ltd | Assembling method for semiconductor device |
| JPS58143541A (ja) * | 1982-02-22 | 1983-08-26 | Hitachi Ltd | 半導体装置 |
| JPS622626A (ja) * | 1985-06-28 | 1987-01-08 | Nec Corp | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2524967Y2 (ja) | 1997-02-05 |