JPH0289835U - - Google Patents
Info
- Publication number
- JPH0289835U JPH0289835U JP1988170941U JP17094188U JPH0289835U JP H0289835 U JPH0289835 U JP H0289835U JP 1988170941 U JP1988170941 U JP 1988170941U JP 17094188 U JP17094188 U JP 17094188U JP H0289835 U JPH0289835 U JP H0289835U
- Authority
- JP
- Japan
- Prior art keywords
- side edge
- bonding pads
- board
- long
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W72/07521—
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- H10W72/07551—
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- H10W72/07553—
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- H10W72/07554—
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- H10W72/50—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/537—
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- H10W72/5445—
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- H10W72/547—
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- H10W72/59—
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- H10W72/932—
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- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988170941U JPH0289835U (enExample) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988170941U JPH0289835U (enExample) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289835U true JPH0289835U (enExample) | 1990-07-17 |
Family
ID=31462324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988170941U Pending JPH0289835U (enExample) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289835U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011101051A (ja) * | 2011-02-07 | 2011-05-19 | Renesas Electronics Corp | 半導体装置及びそのワイヤーボンディング方法 |
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1988
- 1988-12-28 JP JP1988170941U patent/JPH0289835U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011101051A (ja) * | 2011-02-07 | 2011-05-19 | Renesas Electronics Corp | 半導体装置及びそのワイヤーボンディング方法 |