JP2011101051A - 半導体装置及びそのワイヤーボンディング方法 - Google Patents
半導体装置及びそのワイヤーボンディング方法 Download PDFInfo
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Abstract
【解決手段】半導体素子10は、ボンディングパッド12を備えた矩形の半導体チップ14とフィンガー16を備えた矩形のリードフレームよりなる。ワイヤー20により、それぞれのボンディングパッド12とそれぞれのフィンガー16は接合される。ワイヤーは、比較的短い第1のワイヤー群20と、比較的長い第2のワイヤー群(図示せず)に振り分けられる。第1のワイヤー群20のボンディングパッド側接合点は、半導体チップ14の外縁に近い位置に、第2のワイヤー群のボンディングパッド側接合点は、半導体チップ14の外縁から離れた位置にずれている。これにより、先行形成されたワイヤーとキャピラリーの干渉を避けることができる。
【選択図】図1
Description
(1)第1に、プローブ痕とボンディング位置が同じであることに問題がある。探針によりプロービング工程を行うと、ボンディングパッドの表面が荒れる。プローブ痕の上でワイヤーボンディングを行うと、接合が不安定になる。上記従来例では、ボンディングパッドが単列である場合を例示したが、ボンディングパッドが千鳥状で複列であっても同じ問題がある。
12,32,42,52 ボンディングパッド
14 半導体チップ
16,34,44 フィンガー
18 基板
20,36,46 ワイヤー
Claims (16)
- 半導体チップの複数のボンディングパッドと基板の複数のフィンガーとがワイヤーで接合された半導体装置において、
前記ボンディングパッドが、前記半導体チップの外縁に沿って少なくとも一部分が整列して配置され、同列のボンディングパッドにおける少なくとも1つのワイヤーのボンディングパッド側接合点が、当該ワイヤーに隣合うワイヤーのボンディングパッド側接合点と前記外縁に向う方向にずれていることを特徴とする、半導体装置。 - 前記ボンディングパッドが、前記半導体チップの外縁に沿って単列で配置されている、請求項1記載の半導体装置。
- 前記ボンディングパッドが、前記半導体チップの外縁に沿って複列で配置されており、それぞれの列のボンディングパッドにおける少なくとも1つのワイヤーのボンディングパッド側接合点が、当該ワイヤーに隣合うワイヤーのボンディングパッド側接合点と前記外縁に向う方向にずれている、請求項1記載の半導体装置。
- 前記フィンガー側接合点が、前記基板の外縁に向う方向にずれており、互いに近接するボンディングパッド側接合点とフィンガー側接合点を備えた第1のワイヤー群と、互いに離間するボンディングパッド側接合点とフィンガー側接合点を備えた第2のワイヤー群がランダムに配列されている、請求項1記載の半導体装置。
- 前記フィンガー側接合点が、前記基板の外縁に向う方向にずれており、互いに近接するボンディングパッド側接合点とフィンガー側接合点を備えた第1のワイヤー群と、互いに離間するボンディングパッド側接合点とフィンガー側接合点を備えた第2のワイヤー群が交互に配列されている、請求項1記載の半導体装置。
- 前記フィンガーが、前記基板の外縁に沿って単列で配置され、前記ワイヤーにおける少なくとも1つのワイヤーのフィンガー側接合点が、当該ワイヤーに隣合うワイヤーのフィンガー側接合点と前記外縁に向う方向にずれている、請求項4又は5記載の半導体装置。
- 前記ボンディングパッドが、前記外縁に向う方向に縦長であり、前記ワイヤーのボンディングパッド側接合点がボンディングパッドの中心から前記外縁に向う方向にずれている、請求項1乃至3のいずれかに記載の半導体装置。
- 半導体チップの複数のボンディングパッドと前記半導体チップを囲繞する基板の複数のフィンガーとがワイヤーで接合され、隣合うワイヤー間の間隔が前記基板の外縁に向って広がるように構成された半導体装置において、
前記ボンディングパッドが、前記半導体チップの外縁に沿って少なくとも一部分が整列して配置され、前記半導体チップの一辺の両端近傍のワイヤーにおけるボンディングパッド側接合点が、当該ワイヤーに隣合う同列のワイヤーのボンディングパッド側接合点と前記外縁に向う方向にずれていることを特徴とする、半導体装置。 - 前記ボンディングパッドが、前記外縁に向う方向に縦長であり、前記ワイヤーのボンディングパッド側接合点がボンディングパッドの中心から前記外縁に向う方向にずれている、請求項8記載の半導体装置。
- 半導体チップの複数のボンディングパッドと基板の複数のフィンガーとがキャピラリーから送出されるワイヤーで接合された半導体装置におけるワイヤーボンディグ方法において、
フィンガー側接合点によって、比較的短い第1のワイヤー群と比較的長い第2のワイヤー群に振り分け、ボンディングパッド側接合点とフィンガー側接合点を結ぶそれぞれのワイヤー軌道と前記ワイヤーを形成するキャピラリーの軌跡とが干渉するワイヤーについてボンディングパッド側接合点を前記半導体チップの外縁に向う方向にずらす工程;前記第1のワイヤー群のボンディングパッド側接合点とフィンガー側接合点とが当該ワイヤーで接合される工程;及び前記第2のワイヤー群のボンディングパッド側接合点とフィンガー側接合点とが当該ワイヤーで接合される工程;を含むことを特徴とする、ワイヤーボンディング方法。 - 比較的短い第1のワイヤー群と比較的長い第2のワイヤー群に振り分ける際、比較的短い第1のワイヤー群のボンディングパッド側接合点をボンディングパッドの中心から半導体チップの外縁に向ってずらす工程と、比較的長い第2のワイヤー群のボンディングパッド側接合点をボンディングパッドの中心から半導体チップの外縁と反対に向ってずらす工程を含む、請求項10記載のワイヤーボンディング方法。
- 前記ワイヤーを比較的短い第1のワイヤー群と比較的長い第2のワイヤー群をランダムに振り分ける、請求項11記載のワイヤーボンディング方法。
- 前記ワイヤーを比較的短い第1のワイヤー群と比較的長い第2のワイヤー群を交互に振り分ける、請求項11記載のワイヤーボンディング方法。
- 基板が半導体チップに近いフィンガーと半導体チップに遠いフィンガーを備えている半導体装置において、
比較的短い第1のワイヤー群と比較的長い第2のワイヤー群に振り分ける際、前記ワイヤーを、半導体チップに近いフィンガーに対応させて比較的短い第1のワイヤー群を割り当て、半導体チップに遠いフィンガーに対応させて比較的長い第2のワイヤー群を割り当てる工程を含む、請求項11記載のワイヤーボンディング方法。 - 半導体チップの複数のボンディングパッドと基板の複数のフィンガーとがキャピラリーから送出されるワイヤーで接合された半導体装置におけるワイヤーボンディグ方法において、
フィンガー側接合点によって、比較的短い第1のワイヤー群、比較的長い第2のワイヤー群、第1のワイヤー群と第2のワイヤー群との中間的な長さの初期設定ワイヤー群に振り分け、ボンディングパッド側接合点とフィンガー側接合点を結ぶそれぞれのワイヤー軌道と前記ワイヤーを形成するキャピラリーの軌跡とが干渉する第1のワイヤー群と第2のワイヤー群に含まれるワイヤーについてボンディングパッド側接合点を前記半導体チップの外縁に向う方向にずらす工程;前記第1のワイヤー群のボンディングパッド側接合点とフィンガー側接合点とが当該ワイヤーで接合される工程;前記長さ不変の初期設定ワイヤー群のボンディングパッド側接合点とフィンガー側接合点とが当該ワイヤーで接合される工程;及び前記第2のワイヤー群のボンディングパッド側接合点とフィンガー側接合点とが当該ワイヤーで接合される工程;を含むことを特徴とする、ワイヤーボンディング方法。 - 前記ボンディングパッド上のボンディングパッド接合点の中心とプローブの接触位置をずらして、プロービング工程を行う、請求項9乃至15のいずれかに記載のワイヤーボンディング方法。
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