JPH01174927U - - Google Patents
Info
- Publication number
- JPH01174927U JPH01174927U JP1988071638U JP7163888U JPH01174927U JP H01174927 U JPH01174927 U JP H01174927U JP 1988071638 U JP1988071638 U JP 1988071638U JP 7163888 U JP7163888 U JP 7163888U JP H01174927 U JPH01174927 U JP H01174927U
- Authority
- JP
- Japan
- Prior art keywords
- elements
- relay
- conductor
- density
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/50—
-
- H10W72/07554—
-
- H10W72/5445—
-
- H10W72/547—
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- H10W72/5473—
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- H10W72/932—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988071638U JPH01174927U (enExample) | 1988-05-30 | 1988-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988071638U JPH01174927U (enExample) | 1988-05-30 | 1988-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01174927U true JPH01174927U (enExample) | 1989-12-13 |
Family
ID=31296840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988071638U Pending JPH01174927U (enExample) | 1988-05-30 | 1988-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01174927U (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57199228A (en) * | 1981-06-02 | 1982-12-07 | Toshiba Corp | Wire bonding pad device |
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1988
- 1988-05-30 JP JP1988071638U patent/JPH01174927U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57199228A (en) * | 1981-06-02 | 1982-12-07 | Toshiba Corp | Wire bonding pad device |