JPH0474463U - - Google Patents
Info
- Publication number
- JPH0474463U JPH0474463U JP1990116824U JP11682490U JPH0474463U JP H0474463 U JPH0474463 U JP H0474463U JP 1990116824 U JP1990116824 U JP 1990116824U JP 11682490 U JP11682490 U JP 11682490U JP H0474463 U JPH0474463 U JP H0474463U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- chip mounted
- package
- electrically connected
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/20—
-
- H10W90/724—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990116824U JPH0474463U (enExample) | 1990-11-07 | 1990-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990116824U JPH0474463U (enExample) | 1990-11-07 | 1990-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0474463U true JPH0474463U (enExample) | 1992-06-30 |
Family
ID=31864667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990116824U Pending JPH0474463U (enExample) | 1990-11-07 | 1990-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0474463U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006237280A (ja) * | 2005-02-25 | 2006-09-07 | Sony Corp | 半導体装置及びその製造方法 |
-
1990
- 1990-11-07 JP JP1990116824U patent/JPH0474463U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006237280A (ja) * | 2005-02-25 | 2006-09-07 | Sony Corp | 半導体装置及びその製造方法 |