JPH01160841U - - Google Patents
Info
- Publication number
- JPH01160841U JPH01160841U JP1988049666U JP4966688U JPH01160841U JP H01160841 U JPH01160841 U JP H01160841U JP 1988049666 U JP1988049666 U JP 1988049666U JP 4966688 U JP4966688 U JP 4966688U JP H01160841 U JPH01160841 U JP H01160841U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- stitch portion
- package
- semiconductor device
- stitch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W70/682—
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- H10W70/685—
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- H10W72/5445—
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- H10W72/932—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988049666U JPH01160841U (enExample) | 1988-04-13 | 1988-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988049666U JPH01160841U (enExample) | 1988-04-13 | 1988-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160841U true JPH01160841U (enExample) | 1989-11-08 |
Family
ID=31275753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988049666U Pending JPH01160841U (enExample) | 1988-04-13 | 1988-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160841U (enExample) |
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1988
- 1988-04-13 JP JP1988049666U patent/JPH01160841U/ja active Pending