JPS61207026U - - Google Patents
Info
- Publication number
- JPS61207026U JPS61207026U JP1985090114U JP9011485U JPS61207026U JP S61207026 U JPS61207026 U JP S61207026U JP 1985090114 U JP1985090114 U JP 1985090114U JP 9011485 U JP9011485 U JP 9011485U JP S61207026 U JPS61207026 U JP S61207026U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- semiconductor chip
- die bonding
- bonding pattern
- smaller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985090114U JPS61207026U (enExample) | 1985-06-17 | 1985-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985090114U JPS61207026U (enExample) | 1985-06-17 | 1985-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61207026U true JPS61207026U (enExample) | 1986-12-27 |
Family
ID=30644820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985090114U Pending JPS61207026U (enExample) | 1985-06-17 | 1985-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61207026U (enExample) |
-
1985
- 1985-06-17 JP JP1985090114U patent/JPS61207026U/ja active Pending