JPS62192648U - - Google Patents
Info
- Publication number
- JPS62192648U JPS62192648U JP1986079682U JP7968286U JPS62192648U JP S62192648 U JPS62192648 U JP S62192648U JP 1986079682 U JP1986079682 U JP 1986079682U JP 7968286 U JP7968286 U JP 7968286U JP S62192648 U JPS62192648 U JP S62192648U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- bonding pad
- recess
- chip component
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/754—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986079682U JPS62192648U (enExample) | 1986-05-27 | 1986-05-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986079682U JPS62192648U (enExample) | 1986-05-27 | 1986-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62192648U true JPS62192648U (enExample) | 1987-12-08 |
Family
ID=30929776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986079682U Pending JPS62192648U (enExample) | 1986-05-27 | 1986-05-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62192648U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008130618A (ja) * | 2006-11-16 | 2008-06-05 | Murata Mfg Co Ltd | 多層配線基板 |
-
1986
- 1986-05-27 JP JP1986079682U patent/JPS62192648U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008130618A (ja) * | 2006-11-16 | 2008-06-05 | Murata Mfg Co Ltd | 多層配線基板 |