JPS6151737U - - Google Patents
Info
- Publication number
- JPS6151737U JPS6151737U JP13575084U JP13575084U JPS6151737U JP S6151737 U JPS6151737 U JP S6151737U JP 13575084 U JP13575084 U JP 13575084U JP 13575084 U JP13575084 U JP 13575084U JP S6151737 U JPS6151737 U JP S6151737U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- circuit board
- concave portion
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0711—
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- H10W72/07141—
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- H10W72/075—
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- H10W72/07551—
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- H10W72/50—
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- H10W72/5363—
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- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13575084U JPS6151737U (enExample) | 1984-09-07 | 1984-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13575084U JPS6151737U (enExample) | 1984-09-07 | 1984-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6151737U true JPS6151737U (enExample) | 1986-04-07 |
Family
ID=30694232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13575084U Pending JPS6151737U (enExample) | 1984-09-07 | 1984-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6151737U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008010729A (ja) * | 2006-06-30 | 2008-01-17 | Hitachi Aic Inc | 実装基板 |
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1984
- 1984-09-07 JP JP13575084U patent/JPS6151737U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008010729A (ja) * | 2006-06-30 | 2008-01-17 | Hitachi Aic Inc | 実装基板 |