JPS61153374U - - Google Patents
Info
- Publication number
- JPS61153374U JPS61153374U JP1985036431U JP3643185U JPS61153374U JP S61153374 U JPS61153374 U JP S61153374U JP 1985036431 U JP1985036431 U JP 1985036431U JP 3643185 U JP3643185 U JP 3643185U JP S61153374 U JPS61153374 U JP S61153374U
- Authority
- JP
- Japan
- Prior art keywords
- flip
- mounting
- chip semiconductor
- electrode
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/724—
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985036431U JPS61153374U (enExample) | 1985-03-14 | 1985-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985036431U JPS61153374U (enExample) | 1985-03-14 | 1985-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61153374U true JPS61153374U (enExample) | 1986-09-22 |
Family
ID=30541603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985036431U Pending JPS61153374U (enExample) | 1985-03-14 | 1985-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61153374U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0272642A (ja) * | 1988-09-07 | 1990-03-12 | Nec Corp | 基板の接続構造および接続方法 |
-
1985
- 1985-03-14 JP JP1985036431U patent/JPS61153374U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0272642A (ja) * | 1988-09-07 | 1990-03-12 | Nec Corp | 基板の接続構造および接続方法 |