JPH01167043U - - Google Patents
Info
- Publication number
- JPH01167043U JPH01167043U JP1988063554U JP6355488U JPH01167043U JP H01167043 U JPH01167043 U JP H01167043U JP 1988063554 U JP1988063554 U JP 1988063554U JP 6355488 U JP6355488 U JP 6355488U JP H01167043 U JPH01167043 U JP H01167043U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- integrated circuit
- hybrid integrated
- dam
- circuit according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/281—Auxiliary members
- H10W72/287—Flow barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063554U JPH01167043U (enExample) | 1988-05-13 | 1988-05-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063554U JPH01167043U (enExample) | 1988-05-13 | 1988-05-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01167043U true JPH01167043U (enExample) | 1989-11-22 |
Family
ID=31289049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988063554U Pending JPH01167043U (enExample) | 1988-05-13 | 1988-05-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01167043U (enExample) |
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1988
- 1988-05-13 JP JP1988063554U patent/JPH01167043U/ja active Pending