JPH0418439U - - Google Patents
Info
- Publication number
- JPH0418439U JPH0418439U JP1990059922U JP5992290U JPH0418439U JP H0418439 U JPH0418439 U JP H0418439U JP 1990059922 U JP1990059922 U JP 1990059922U JP 5992290 U JP5992290 U JP 5992290U JP H0418439 U JPH0418439 U JP H0418439U
- Authority
- JP
- Japan
- Prior art keywords
- lead electrodes
- package
- chip
- semiconductor package
- simplified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990059922U JPH0418439U (enExample) | 1990-06-05 | 1990-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990059922U JPH0418439U (enExample) | 1990-06-05 | 1990-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0418439U true JPH0418439U (enExample) | 1992-02-17 |
Family
ID=31586850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990059922U Pending JPH0418439U (enExample) | 1990-06-05 | 1990-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0418439U (enExample) |
-
1990
- 1990-06-05 JP JP1990059922U patent/JPH0418439U/ja active Pending