JPH0284329U - - Google Patents
Info
- Publication number
- JPH0284329U JPH0284329U JP1988165413U JP16541388U JPH0284329U JP H0284329 U JPH0284329 U JP H0284329U JP 1988165413 U JP1988165413 U JP 1988165413U JP 16541388 U JP16541388 U JP 16541388U JP H0284329 U JPH0284329 U JP H0284329U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- bonding pad
- octagonal
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W72/07551—
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- H10W72/50—
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- H10W72/536—
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- H10W72/59—
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- H10W72/932—
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- H10W72/983—
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988165413U JPH0284329U (enExample) | 1988-12-20 | 1988-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988165413U JPH0284329U (enExample) | 1988-12-20 | 1988-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0284329U true JPH0284329U (enExample) | 1990-06-29 |
Family
ID=31451875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988165413U Pending JPH0284329U (enExample) | 1988-12-20 | 1988-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0284329U (enExample) |
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1988
- 1988-12-20 JP JP1988165413U patent/JPH0284329U/ja active Pending