JPH0245651U - - Google Patents
Info
- Publication number
- JPH0245651U JPH0245651U JP1988124555U JP12455588U JPH0245651U JP H0245651 U JPH0245651 U JP H0245651U JP 1988124555 U JP1988124555 U JP 1988124555U JP 12455588 U JP12455588 U JP 12455588U JP H0245651 U JPH0245651 U JP H0245651U
- Authority
- JP
- Japan
- Prior art keywords
- plastic
- metal plate
- mold
- sealed
- element chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988124555U JPH0245651U (enExample) | 1988-09-22 | 1988-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988124555U JPH0245651U (enExample) | 1988-09-22 | 1988-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245651U true JPH0245651U (enExample) | 1990-03-29 |
Family
ID=31374392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988124555U Pending JPH0245651U (enExample) | 1988-09-22 | 1988-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245651U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015133024A1 (ja) * | 2014-03-06 | 2015-09-11 | 三菱電機株式会社 | 電力用半導体装置 |
-
1988
- 1988-09-22 JP JP1988124555U patent/JPH0245651U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015133024A1 (ja) * | 2014-03-06 | 2015-09-11 | 三菱電機株式会社 | 電力用半導体装置 |
| JPWO2015133024A1 (ja) * | 2014-03-06 | 2017-04-06 | 三菱電機株式会社 | 電力用半導体装置 |
| EP3116023A4 (en) * | 2014-03-06 | 2017-12-06 | Mitsubishi Electric Corporation | Power semiconductor device |