JPH0336151U - - Google Patents
Info
- Publication number
- JPH0336151U JPH0336151U JP1989096919U JP9691989U JPH0336151U JP H0336151 U JPH0336151 U JP H0336151U JP 1989096919 U JP1989096919 U JP 1989096919U JP 9691989 U JP9691989 U JP 9691989U JP H0336151 U JPH0336151 U JP H0336151U
- Authority
- JP
- Japan
- Prior art keywords
- mounting portion
- length
- chip mounting
- lead frame
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/073—
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- H10W72/536—
-
- H10W72/884—
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- H10W90/736—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989096919U JPH0336151U (enExample) | 1989-08-19 | 1989-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989096919U JPH0336151U (enExample) | 1989-08-19 | 1989-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0336151U true JPH0336151U (enExample) | 1991-04-09 |
Family
ID=31646092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989096919U Pending JPH0336151U (enExample) | 1989-08-19 | 1989-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0336151U (enExample) |
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1989
- 1989-08-19 JP JP1989096919U patent/JPH0336151U/ja active Pending