JPH0456337U - - Google Patents
Info
- Publication number
- JPH0456337U JPH0456337U JP1990098114U JP9811490U JPH0456337U JP H0456337 U JPH0456337 U JP H0456337U JP 1990098114 U JP1990098114 U JP 1990098114U JP 9811490 U JP9811490 U JP 9811490U JP H0456337 U JPH0456337 U JP H0456337U
- Authority
- JP
- Japan
- Prior art keywords
- heater block
- wire bonder
- semiconductor device
- die pad
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/536—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990098114U JPH0456337U (enExample) | 1990-09-20 | 1990-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990098114U JPH0456337U (enExample) | 1990-09-20 | 1990-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0456337U true JPH0456337U (enExample) | 1992-05-14 |
Family
ID=31839039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990098114U Pending JPH0456337U (enExample) | 1990-09-20 | 1990-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0456337U (enExample) |
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1990
- 1990-09-20 JP JP1990098114U patent/JPH0456337U/ja active Pending