JPH0456337U - - Google Patents
Info
- Publication number
- JPH0456337U JPH0456337U JP9811490U JP9811490U JPH0456337U JP H0456337 U JPH0456337 U JP H0456337U JP 9811490 U JP9811490 U JP 9811490U JP 9811490 U JP9811490 U JP 9811490U JP H0456337 U JPH0456337 U JP H0456337U
- Authority
- JP
- Japan
- Prior art keywords
- heater block
- wire bonder
- semiconductor device
- die pad
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の実施例を示すワイヤボンダの
ボンデイングエリア部の構成図、第２図は本考案
のワイヤボンダのヒータブロツクの平面図、第３
図乃至第７図は本考案のワイヤボンダのヒータブ
ロツクの変形例を示す図、第８図は従来のワイヤ
ボンダのボンデイングエリア部の構成図、第９図
は従来技術の問題点説明図である。 ３……ダイパツド、４……インナリード、１１
，２１，３１，４１，５１，６１……ヒータブロ
ツク、１２，２２，３２，４２，５２，６２……
凸部、１３……間隙。
ボンデイングエリア部の構成図、第２図は本考案
のワイヤボンダのヒータブロツクの平面図、第３
図乃至第７図は本考案のワイヤボンダのヒータブ
ロツクの変形例を示す図、第８図は従来のワイヤ
ボンダのボンデイングエリア部の構成図、第９図
は従来技術の問題点説明図である。 ３……ダイパツド、４……インナリード、１１
，２１，３１，４１，５１，６１……ヒータブロ
ツク、１２，２２，３２，４２，５２，６２……
凸部、１３……間隙。
Claims (1)
- 【実用新案登録請求の範囲】 半導体素子の配線を行うワイヤボンダのヒータ
ブロツクにおいて、 ヒータブロツクの上面に凹凸部を形成し、該凹
部に異物を入り込ませ、前記凸部によつて半導体
素子が搭載されるダイパツド及びインナリードを
支持してなるワイヤボンダのヒータブロツク。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9811490U JPH0456337U (ja) | 1990-09-20 | 1990-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9811490U JPH0456337U (ja) | 1990-09-20 | 1990-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0456337U true JPH0456337U (ja) | 1992-05-14 |
Family
ID=31839039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9811490U Pending JPH0456337U (ja) | 1990-09-20 | 1990-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0456337U (ja) |
-
1990
- 1990-09-20 JP JP9811490U patent/JPH0456337U/ja active Pending