JPH01129849U - - Google Patents

Info

Publication number
JPH01129849U
JPH01129849U JP2416988U JP2416988U JPH01129849U JP H01129849 U JPH01129849 U JP H01129849U JP 2416988 U JP2416988 U JP 2416988U JP 2416988 U JP2416988 U JP 2416988U JP H01129849 U JPH01129849 U JP H01129849U
Authority
JP
Japan
Prior art keywords
die pad
lead frame
lead
support bar
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2416988U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2416988U priority Critical patent/JPH01129849U/ja
Publication of JPH01129849U publication Critical patent/JPH01129849U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案実施例のリードフレームの斜視
図、第２図ａおよび第２図ｂは同のリードフレー
ムの製造工程図、第３図は通常のリードフレーム
を示す図、第４図は通常の半導体装置を示す図、
第５図は従来例のリードフレームの変形状態を示
す図である。 １……リードフレーム、２……半導体チツプ、
３……ワイヤ、４……封止材料、１１……ダイパ
ツド、１２……インナーリード、１３……タイバ
ー、１４……アウターリード、１５，１６……サ
イドバー、１７……サポートバー、２０……変形
部、２１……デインプル、２２……Ｖノツチ。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体チツプを搭載するためのダイパツドと、 ダイパツドの周りに配設せしめられる複数のイ
    ンナーリードと、 各インナーリードに連設せしめられるアウター
    リードと、 ダイパツドを支持するサポートバーとを備えた
    リードフレームにおいて、 前記サポートバーが、リードフレーム面から突
    出する変形部を具備してなることを特徴とするリ
    ードフレーム。
JP2416988U 1988-02-25 1988-02-25 Pending JPH01129849U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2416988U JPH01129849U (ja) 1988-02-25 1988-02-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2416988U JPH01129849U (ja) 1988-02-25 1988-02-25

Publications (1)

Publication Number Publication Date
JPH01129849U true JPH01129849U (ja) 1989-09-04

Family

ID=31243787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2416988U Pending JPH01129849U (ja) 1988-02-25 1988-02-25

Country Status (1)

Country Link
JP (1) JPH01129849U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093983A (ja) * 2000-09-13 2002-03-29 Murata Mfg Co Ltd 電子部品の切離し構造

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62254457A (ja) * 1986-04-28 1987-11-06 Nec Corp Ｉｃ用リ−ドフレ−ム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62254457A (ja) * 1986-04-28 1987-11-06 Nec Corp Ｉｃ用リ−ドフレ−ム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093983A (ja) * 2000-09-13 2002-03-29 Murata Mfg Co Ltd 電子部品の切離し構造
JP4505967B2 (ja) * 2000-09-13 2010-07-21 株式会社村田製作所 電子部品の切離し構造

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