JPH0459956U - - Google Patents

Info

Publication number
JPH0459956U
JPH0459956U JP10238390U JP10238390U JPH0459956U JP H0459956 U JPH0459956 U JP H0459956U JP 10238390 U JP10238390 U JP 10238390U JP 10238390 U JP10238390 U JP 10238390U JP H0459956 U JPH0459956 U JP H0459956U
Authority
JP
Japan
Prior art keywords
island
lead frame
bonding
suspension
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10238390U
Other languages
English (en)
Other versions
JP2520527Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990102383U priority Critical patent/JP2520527Y2/ja
Publication of JPH0459956U publication Critical patent/JPH0459956U/ja
Application granted granted Critical
Publication of JP2520527Y2 publication Critical patent/JP2520527Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

Description

【図面の簡単な説明】
第１図は本考案によるリードフレームの一実施
例を示す平面図、第２図は本考案によるリードフ
レームの他の実施例を示す平面図、第３図は従来
のリードフレームの一例を示す平面図である。 １０……リードフレーム、１１……アイランド
、１１ａ……ボンデイングパツド、１２……アイ
ランド吊り上、１２ａ……ボンデイング箇所、１
２ｂ……延長部分、１３ａ，１３ｂ，１３ｃ，１
３ｄ，１３ｅ，１３ｆ……インナーリード、１４
……ワイヤボンデイング、２０……リードフレー
ム、１５……チツプ。

Claims (1)

  1. 【実用新案登録請求の範囲】 アイランドを支持するアイランド吊り上と、該
    アイランドの周りに配設された複数個のインナー
    リードとを含むリードフレームにおいて、 上記アイランド上に実装されるチツプのアース
    用ボンデイングパツドとアイランド吊り上とをワ
    イヤボンデイング接続することを特徴とするリー
    ドフレーム。
JP1990102383U 1990-09-29 1990-09-29 リードフレーム Expired - Lifetime JP2520527Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990102383U JP2520527Y2 (ja) 1990-09-29 1990-09-29 リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990102383U JP2520527Y2 (ja) 1990-09-29 1990-09-29 リードフレーム

Publications (2)

Publication Number Publication Date
JPH0459956U true JPH0459956U (ja) 1992-05-22
JP2520527Y2 JP2520527Y2 (ja) 1996-12-18

Family

ID=31846594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990102383U Expired - Lifetime JP2520527Y2 (ja) 1990-09-29 1990-09-29 リードフレーム

Country Status (1)

Country Link
JP (1) JP2520527Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0878595A (ja) * 1994-08-29 1996-03-22 Analog Devices Inc <Adi> 改善された熱放散を備えたｉｃパッケージ
JP2006032775A (ja) * 2004-07-20 2006-02-02 Denso Corp 電子装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5910249A (ja) * 1982-07-09 1984-01-19 Nec Corp 半導体装置用リ−ドフレ−ム
JPS6070755A (ja) * 1983-09-28 1985-04-22 Hitachi Micro Comput Eng Ltd 半導体装置
JPS60105747A (ja) * 1983-11-14 1985-06-11 株式会社イナックス タイルパネル構成体を利用した吊天井構造
JPS60123046A (ja) * 1983-12-07 1985-07-01 Toshiba Corp 半導体装置
JPS60119756U (ja) * 1984-01-20 1985-08-13 三洋電機株式会社 リ−ドフレ−ム
JPS639149U (ja) * 1986-07-03 1988-01-21
JPS63108759A (ja) * 1986-10-27 1988-05-13 Rohm Co Ltd 半導体装置の製造方法
JPH01143246A (ja) * 1987-11-30 1989-06-05 Nec Corp 半導体装置
JPH01244654A (ja) * 1988-03-25 1989-09-29 Nec Kyushu Ltd リードフレーム
JPH02174254A (ja) * 1988-12-27 1990-07-05 Nec Corp Ｉｃパッケージ

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5910249A (ja) * 1982-07-09 1984-01-19 Nec Corp 半導体装置用リ−ドフレ−ム
JPS6070755A (ja) * 1983-09-28 1985-04-22 Hitachi Micro Comput Eng Ltd 半導体装置
JPS60105747A (ja) * 1983-11-14 1985-06-11 株式会社イナックス タイルパネル構成体を利用した吊天井構造
JPS60123046A (ja) * 1983-12-07 1985-07-01 Toshiba Corp 半導体装置
JPS60119756U (ja) * 1984-01-20 1985-08-13 三洋電機株式会社 リ−ドフレ−ム
JPS639149U (ja) * 1986-07-03 1988-01-21
JPS63108759A (ja) * 1986-10-27 1988-05-13 Rohm Co Ltd 半導体装置の製造方法
JPH01143246A (ja) * 1987-11-30 1989-06-05 Nec Corp 半導体装置
JPH01244654A (ja) * 1988-03-25 1989-09-29 Nec Kyushu Ltd リードフレーム
JPH02174254A (ja) * 1988-12-27 1990-07-05 Nec Corp Ｉｃパッケージ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0878595A (ja) * 1994-08-29 1996-03-22 Analog Devices Inc <Adi> 改善された熱放散を備えたｉｃパッケージ
JP2006032775A (ja) * 2004-07-20 2006-02-02 Denso Corp 電子装置
JP4590961B2 (ja) * 2004-07-20 2010-12-01 株式会社デンソー 電子装置

Also Published As

Publication number Publication date
JP2520527Y2 (ja) 1996-12-18

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