JPH01129849U - - Google Patents

Info

Publication number
JPH01129849U
JPH01129849U JP1988024169U JP2416988U JPH01129849U JP H01129849 U JPH01129849 U JP H01129849U JP 1988024169 U JP1988024169 U JP 1988024169U JP 2416988 U JP2416988 U JP 2416988U JP H01129849 U JPH01129849 U JP H01129849U
Authority
JP
Japan
Prior art keywords
die pad
lead frame
lead
support bar
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988024169U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988024169U priority Critical patent/JPH01129849U/ja
Publication of JPH01129849U publication Critical patent/JPH01129849U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/756

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988024169U 1988-02-25 1988-02-25 Pending JPH01129849U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988024169U JPH01129849U (enExample) 1988-02-25 1988-02-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988024169U JPH01129849U (enExample) 1988-02-25 1988-02-25

Publications (1)

Publication Number Publication Date
JPH01129849U true JPH01129849U (enExample) 1989-09-04

Family

ID=31243787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988024169U Pending JPH01129849U (enExample) 1988-02-25 1988-02-25

Country Status (1)

Country Link
JP (1) JPH01129849U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093983A (ja) * 2000-09-13 2002-03-29 Murata Mfg Co Ltd 電子部品の切離し構造

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62254457A (ja) * 1986-04-28 1987-11-06 Nec Corp Ic用リ−ドフレ−ム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62254457A (ja) * 1986-04-28 1987-11-06 Nec Corp Ic用リ−ドフレ−ム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093983A (ja) * 2000-09-13 2002-03-29 Murata Mfg Co Ltd 電子部品の切離し構造

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