JPH0351849U - - Google Patents
Info
- Publication number
- JPH0351849U JPH0351849U JP1989112645U JP11264589U JPH0351849U JP H0351849 U JPH0351849 U JP H0351849U JP 1989112645 U JP1989112645 U JP 1989112645U JP 11264589 U JP11264589 U JP 11264589U JP H0351849 U JPH0351849 U JP H0351849U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- land portion
- arrangement
- pellet
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989112645U JPH0741164Y2 (ja) | 1989-09-26 | 1989-09-26 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989112645U JPH0741164Y2 (ja) | 1989-09-26 | 1989-09-26 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0351849U true JPH0351849U (enExample) | 1991-05-20 |
| JPH0741164Y2 JPH0741164Y2 (ja) | 1995-09-20 |
Family
ID=31661088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989112645U Expired - Lifetime JPH0741164Y2 (ja) | 1989-09-26 | 1989-09-26 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0741164Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012108011A1 (ja) * | 2011-02-09 | 2012-08-16 | 三菱電機株式会社 | パワー半導体モジュール |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103210571A (zh) | 2010-11-02 | 2013-07-17 | 三菱电机株式会社 | 电动式动力转向用电源模块及使用其的电动式动力转向驱动控制装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63151055A (ja) * | 1986-12-16 | 1988-06-23 | Matsushita Electronics Corp | 複合型半導体装置 |
| JPS63255953A (ja) * | 1987-04-13 | 1988-10-24 | Sanken Electric Co Ltd | 絶縁物封止型回路装置 |
-
1989
- 1989-09-26 JP JP1989112645U patent/JPH0741164Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63151055A (ja) * | 1986-12-16 | 1988-06-23 | Matsushita Electronics Corp | 複合型半導体装置 |
| JPS63255953A (ja) * | 1987-04-13 | 1988-10-24 | Sanken Electric Co Ltd | 絶縁物封止型回路装置 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012108011A1 (ja) * | 2011-02-09 | 2012-08-16 | 三菱電機株式会社 | パワー半導体モジュール |
| JP5669866B2 (ja) * | 2011-02-09 | 2015-02-18 | 三菱電機株式会社 | パワー半導体モジュール |
| US9129949B2 (en) | 2011-02-09 | 2015-09-08 | Mitsubishi Electric Corporation | Power semiconductor module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0741164Y2 (ja) | 1995-09-20 |