JPS6336052U - - Google Patents
Info
- Publication number
- JPS6336052U JPS6336052U JP1986129468U JP12946886U JPS6336052U JP S6336052 U JPS6336052 U JP S6336052U JP 1986129468 U JP1986129468 U JP 1986129468U JP 12946886 U JP12946886 U JP 12946886U JP S6336052 U JPS6336052 U JP S6336052U
- Authority
- JP
- Japan
- Prior art keywords
- motherboard
- top surface
- logic lsi
- chip module
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/884—
-
- H10W90/734—
-
- H10W90/754—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986129468U JPS6336052U (enExample) | 1986-08-27 | 1986-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986129468U JPS6336052U (enExample) | 1986-08-27 | 1986-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6336052U true JPS6336052U (enExample) | 1988-03-08 |
Family
ID=31026062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986129468U Pending JPS6336052U (enExample) | 1986-08-27 | 1986-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6336052U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0373458U (enExample) * | 1989-11-22 | 1991-07-24 | ||
| JPH0613540A (ja) * | 1991-12-03 | 1994-01-21 | Nec Corp | マルチチップモジュール |
| WO2008108335A1 (ja) * | 2007-03-06 | 2008-09-12 | Nikon Corporation | 半導体装置 |
-
1986
- 1986-08-27 JP JP1986129468U patent/JPS6336052U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0373458U (enExample) * | 1989-11-22 | 1991-07-24 | ||
| JPH0613540A (ja) * | 1991-12-03 | 1994-01-21 | Nec Corp | マルチチップモジュール |
| WO2008108335A1 (ja) * | 2007-03-06 | 2008-09-12 | Nikon Corporation | 半導体装置 |
| JP5521546B2 (ja) * | 2007-03-06 | 2014-06-18 | 株式会社ニコン | 半導体装置 |
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