JPS59107157U - GaAs半導体装置 - Google Patents

GaAs半導体装置

Info

Publication number
JPS59107157U
JPS59107157U JP1983000648U JP64883U JPS59107157U JP S59107157 U JPS59107157 U JP S59107157U JP 1983000648 U JP1983000648 U JP 1983000648U JP 64883 U JP64883 U JP 64883U JP S59107157 U JPS59107157 U JP S59107157U
Authority
JP
Japan
Prior art keywords
semiconductor device
gaas semiconductor
header
pellet
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983000648U
Other languages
English (en)
Inventor
佐々木久雄
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1983000648U priority Critical patent/JPS59107157U/ja
Publication of JPS59107157U publication Critical patent/JPS59107157U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385Shape, e.g. interlocking features

Landscapes

  • Junction Field-Effect Transistors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第1図は本考案の一実施例を示す断面図である。 1・・・・・・ペレット、2・・・・・・溝、計・・・
・・ソルダー、4・・・・・・ヘッダー、5・・・・・
・ヒートシンク。

Claims (1)

    【実用新案登録請求の範囲】
  1. GaAs半導体ペレットと、これが固着されるヘッダー
    とを有するGaAs半導体装置において、前記ヘッダー
    はヒートシン′り上に一体に形成され、前記ベレットの
    固着面と対応する部分のヘッダー面に溝が設けられてい
    ることを特徴とするGaAs半導体装置。
JP1983000648U 1983-01-07 1983-01-07 GaAs半導体装置 Pending JPS59107157U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983000648U JPS59107157U (ja) 1983-01-07 1983-01-07 GaAs半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983000648U JPS59107157U (ja) 1983-01-07 1983-01-07 GaAs半導体装置

Publications (1)

Publication Number Publication Date
JPS59107157U true JPS59107157U (ja) 1984-07-19

Family

ID=30132397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983000648U Pending JPS59107157U (ja) 1983-01-07 1983-01-07 GaAs半導体装置

Country Status (1)

Country Link
JP (1) JPS59107157U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009200250A (ja) * 2008-02-21 2009-09-03 Nec Corp 半導体素子の実装構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009200250A (ja) * 2008-02-21 2009-09-03 Nec Corp 半導体素子の実装構造

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