JPS6052635U - リ−ドフレ−ム - Google Patents
リ−ドフレ−ムInfo
- Publication number
- JPS6052635U JPS6052635U JP14525783U JP14525783U JPS6052635U JP S6052635 U JPS6052635 U JP S6052635U JP 14525783 U JP14525783 U JP 14525783U JP 14525783 U JP14525783 U JP 14525783U JP S6052635 U JPS6052635 U JP S6052635U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- recorded
- chip
- groove
- carved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は本考案に係るリードフレームの要部平面図であ
り、第2図はリードフレーム上に刻設された凹溝の断面
図であり、第3図は本考案に係る別のリードフレームの
要部平面図である。 1・・・リードフレーム、2・・・ICチップ1.3・
・・アイランド部、8・・・凹溝。
り、第2図はリードフレーム上に刻設された凹溝の断面
図であり、第3図は本考案に係る別のリードフレームの
要部平面図である。 1・・・リードフレーム、2・・・ICチップ1.3・
・・アイランド部、8・・・凹溝。
Claims (1)
- リードフレームのアイランド部上のICチップが設けら
れていない部分に、凹溝が刻設されていることを特徴と
するリードフレーム。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14525783U JPS6052635U (ja) | 1983-09-20 | 1983-09-20 | リ−ドフレ−ム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14525783U JPS6052635U (ja) | 1983-09-20 | 1983-09-20 | リ−ドフレ−ム |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6052635U true JPS6052635U (ja) | 1985-04-13 |
Family
ID=30323679
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14525783U Pending JPS6052635U (ja) | 1983-09-20 | 1983-09-20 | リ−ドフレ−ム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6052635U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013175551A (ja) * | 2012-02-24 | 2013-09-05 | Semiconductor Components Industries Llc | 半導体装置 |
-
1983
- 1983-09-20 JP JP14525783U patent/JPS6052635U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013175551A (ja) * | 2012-02-24 | 2013-09-05 | Semiconductor Components Industries Llc | 半導体装置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6052635U (ja) | リ−ドフレ−ム | |
JPS5984520U (ja) | 眼鏡のテンプル | |
JPS5844858U (ja) | リ−ドフレ−ム | |
JPS58124426U (ja) | 帽子 | |
JPS5987142U (ja) | Icパツケ−ジ | |
JPS60181051U (ja) | リ−ドフレ−ムの構造 | |
JPS60153543U (ja) | 半導体装置用リ−ドフレ−ム | |
JPS609235U (ja) | ボンデイングパツド | |
JPS60108273U (ja) | ポツトの注ぎ口 | |
JPS6094834U (ja) | 半導体装置 | |
JPS6038796U (ja) | 平行線定規 | |
JPS60101756U (ja) | 半導体装置用リ−ドフレ−ム | |
JPS59169655U (ja) | 電子機器 | |
JPS59145055U (ja) | 半導体レ−ザ用ヒ−トシンク | |
JPS6094832U (ja) | 半導体素子 | |
JPS60101755U (ja) | 半導体装置 | |
JPS6014739U (ja) | 体が入る机 | |
JPS6120203U (ja) | ホルダ | |
JPS59148088U (ja) | Icソケツト | |
JPS5967636U (ja) | デイスクブレ−キパツド | |
JPS581321U (ja) | 宝玉 | |
JPS6063975U (ja) | リ−ド板 | |
JPS59107157U (ja) | GaAs半導体装置 | |
JPS60179044U (ja) | 集積回路装置 | |
JPS6056599U (ja) | 硯 |