JPS6094832U - 半導体素子 - Google Patents

半導体素子

Info

Publication number
JPS6094832U
JPS6094832U JP18634183U JP18634183U JPS6094832U JP S6094832 U JPS6094832 U JP S6094832U JP 18634183 U JP18634183 U JP 18634183U JP 18634183 U JP18634183 U JP 18634183U JP S6094832 U JPS6094832 U JP S6094832U
Authority
JP
Japan
Prior art keywords
recess
contour
support plate
semiconductor element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18634183U
Other languages
English (en)
Inventor
山岸　始男
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP18634183U priority Critical patent/JPS6094832U/ja
Publication of JPS6094832U publication Critical patent/JPS6094832U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体素子の要部の平面図、第２図はそ
のＡ−Ａ線断面図、第３図は本考案の一実施例の要部の
平面図、第４図はそのＢ−Ｂ線断面図である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体片が支持板上に固着されるものにおいて、支持板
    が半導体片の輪郭よりやや大きい輪郭をもつくぼみと、
    該くぼみ中に設けられ、大部分は該くぼみの輪郭に平行
    であるが二対の対向する場所に内側に向って突出する部
    分を持つ輪郭を有するより深いくぼみを備えたことを特
    徴とする半導体素子。
JP18634183U 1983-12-01 1983-12-01 半導体素子 Pending JPS6094832U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18634183U JPS6094832U (ja) 1983-12-01 1983-12-01 半導体素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18634183U JPS6094832U (ja) 1983-12-01 1983-12-01 半導体素子

Publications (1)

Publication Number Publication Date
JPS6094832U true JPS6094832U (ja) 1985-06-28

Family

ID=30402512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18634183U Pending JPS6094832U (ja) 1983-12-01 1983-12-01 半導体素子

Country Status (1)

Country Link
JP (1) JPS6094832U (ja)

Similar Documents

Publication Publication Date Title
JPS6094832U (ja) 半導体素子
JPS58180643U (ja) 半導体装置のパツケ−ジ
JPS6052834U (ja) 指圧用指サポ−タ−
JPS59107192U (ja) 回路ブロツクの放熱構造
JPS59145055U (ja) 半導体レ−ザ用ヒ−トシンク
JPS59178176U (ja) 箸
JPS6049053U (ja) ジャッキ固定装置
JPS6052635U (ja) リ−ドフレ−ム
JPS6038796U (ja) 平行線定規
JPS58170660U (ja) ブレ−ドクリ−ニング装置
JPS5812938U (ja) 半導体ウエ−ハ
JPS5965550U (ja) リ−ドフレ−ム
JPS58145523U (ja) 振動検知器
JPS6058039U (ja) 組み合わせ家具
JPS59173389U (ja) 傾斜部材における板部材の取付構造
JPS58154647U (ja) 流し台
JPS5987142U (ja) Ｉｃパツケ−ジ
JPS6096089U (ja) 平行線引き用定規
JPS6016547U (ja) ３端子半導体素子の取付装置
JPS59169655U (ja) 電子機器
JPS59102386U (ja) 磁気製図板用図面押えプレ−ト
JPS6013845U (ja) ベルクロ付きシ−トベルト
JPS58131078U (ja) 時計ケ−スにおける銘板の固定構造
JPS6011448U (ja) 半導体装置
JPS6061887U (ja) 小型スピ−カ−