JPS60113642U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS60113642U JPS60113642U JP1984001129U JP112984U JPS60113642U JP S60113642 U JPS60113642 U JP S60113642U JP 1984001129 U JP1984001129 U JP 1984001129U JP 112984 U JP112984 U JP 112984U JP S60113642 U JPS60113642 U JP S60113642U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- substrate
- heat sink
- external heat
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来の半導体装置の構造例を示す断面図、第2
図は第1図に示した半導体装置の外部放熱板への取付構
造を示す側面図、第3図及び第4図は本考案の一実施例
の半導体装置及び外部放熱板を示す断面図及び斜視図、
第5図は第3区及び第4図に示す半導体装置と外部放熱
板との嵌着状態を示す平面図、第6図は本考案の他の実
施例である半導体装置の斜視図上ある。 11・・・基板、lla・・・導出部、lla’、11
a″・・・切り残された部分、12・・・半導体ペレッ
ト、16.16’・・・屈曲片、17・・・外部放熱板
、18・・・空間。
図は第1図に示した半導体装置の外部放熱板への取付構
造を示す側面図、第3図及び第4図は本考案の一実施例
の半導体装置及び外部放熱板を示す断面図及び斜視図、
第5図は第3区及び第4図に示す半導体装置と外部放熱
板との嵌着状態を示す平面図、第6図は本考案の他の実
施例である半導体装置の斜視図上ある。 11・・・基板、lla・・・導出部、lla’、11
a″・・・切り残された部分、12・・・半導体ペレッ
ト、16.16’・・・屈曲片、17・・・外部放熱板
、18・・・空間。
Claims (1)
- 半導体ペレットを載置した基板の一部を屈曲して、この
屈曲片と基板との間に外部放熱板を嵌着保持できる空間
を形成したことを特徴とする半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984001129U JPS60113642U (ja) | 1984-01-09 | 1984-01-09 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984001129U JPS60113642U (ja) | 1984-01-09 | 1984-01-09 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60113642U true JPS60113642U (ja) | 1985-08-01 |
Family
ID=30473590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984001129U Pending JPS60113642U (ja) | 1984-01-09 | 1984-01-09 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60113642U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08125079A (ja) * | 1994-10-25 | 1996-05-17 | Rohm Co Ltd | 半導体装置の放熱板取り付け構造 |
-
1984
- 1984-01-09 JP JP1984001129U patent/JPS60113642U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08125079A (ja) * | 1994-10-25 | 1996-05-17 | Rohm Co Ltd | 半導体装置の放熱板取り付け構造 |
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