JPS60119750U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60119750U
JPS60119750U JP882384U JP882384U JPS60119750U JP S60119750 U JPS60119750 U JP S60119750U JP 882384 U JP882384 U JP 882384U JP 882384 U JP882384 U JP 882384U JP S60119750 U JPS60119750 U JP S60119750U
Authority
JP
Japan
Prior art keywords
sides
heat dissipation
radiation fin
heat radiation
semiconductor equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP882384U
Other languages
English (en)
Inventor
達彦 入江
二郎 橋爪
茂成 高見
林　良茂
Original Assignee
松下電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電工株式会社 filed Critical 松下電工株式会社
Priority to JP882384U priority Critical patent/JPS60119750U/ja
Publication of JPS60119750U publication Critical patent/JPS60119750U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図乃至第５図はこの考案の従来例を示す図で、第１
図は平面図、第２図は断面図、第３図は斜視図、第４図
及び第５図は平面図、第６図乃至第８図はこの考案の一
実施例を示す図で、第６図は平面図、第７図は第６図の
側面図、第８図は斜視図である。図面において、１は放
熱フィン、２は端子、３は半導体素子である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 一側部に３個の端子を並列に配し、中央の端子を放熱フ
    ィンに接続し、両側の端子を放熱フィンの両側に延長し
    、放熱フィン上に半導体素子を搭載接続すると共に該半
    導体素子と端子の放熱フィンの両側に延長した部分とを
    ワイヤーで接続し、放熱ワインの半導体素子の搭載部の
    樹脂封止して成ることを特徴とする半導体装置。
JP882384U 1984-01-24 1984-01-24 半導体装置 Pending JPS60119750U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP882384U JPS60119750U (ja) 1984-01-24 1984-01-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP882384U JPS60119750U (ja) 1984-01-24 1984-01-24 半導体装置

Publications (1)

Publication Number Publication Date
JPS60119750U true JPS60119750U (ja) 1985-08-13

Family

ID=30488464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP882384U Pending JPS60119750U (ja) 1984-01-24 1984-01-24 半導体装置

Country Status (1)

Country Link
JP (1) JPS60119750U (ja)

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