JPS6142853U - 樹脂封止型半導体装置 - Google Patents
樹脂封止型半導体装置Info
- Publication number
- JPS6142853U JPS6142853U JP1984127428U JP12742884U JPS6142853U JP S6142853 U JPS6142853 U JP S6142853U JP 1984127428 U JP1984127428 U JP 1984127428U JP 12742884 U JP12742884 U JP 12742884U JP S6142853 U JPS6142853 U JP S6142853U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- plate
- semiconductor element
- wax material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は本考案の一実施例である樹脂封止型半導体装置
を示す断面図、第2図、第3図は本考案で使用するヒ=
トシンク板を示す斜視図、第4図は従来例を示す断面図
である。 主な図番の説明、1は放熱板、2は絶縁板、3Ct半導
体素子、4はヒートシンク板、5はファストン端子、6
はリード線、7は溝、8は蝋材、9は樹脂である。
を示す断面図、第2図、第3図は本考案で使用するヒ=
トシンク板を示す斜視図、第4図は従来例を示す断面図
である。 主な図番の説明、1は放熱板、2は絶縁板、3Ct半導
体素子、4はヒートシンク板、5はファストン端子、6
はリード線、7は溝、8は蝋材、9は樹脂である。
Claims (1)
- 熱伝導の優れた放熱板と該放熱板の上に蝋材で固着され
た絶縁板と該絶縁板の上に蝋材で固着された半導体素子
と該半導体素子と電気的に接続されたファストン端子と
を具備する樹脂封止型半導体装置において、前記絶縁板
と半導体素子の間に蝋材で固着されるヒートシンク板と
、該ヒートシンク板の少なくとも一面に接着強度を増す
ため設けた溝部とを具備することを特徴とした樹脂封止
型半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984127428U JPS6142853U (ja) | 1984-08-22 | 1984-08-22 | 樹脂封止型半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984127428U JPS6142853U (ja) | 1984-08-22 | 1984-08-22 | 樹脂封止型半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6142853U true JPS6142853U (ja) | 1986-03-19 |
Family
ID=30686072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984127428U Pending JPS6142853U (ja) | 1984-08-22 | 1984-08-22 | 樹脂封止型半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6142853U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3703110A1 (en) * | 2014-03-04 | 2020-09-02 | Rohm Co., Ltd. | Semiconductor device and method of manufacturing semiconductor device |
-
1984
- 1984-08-22 JP JP1984127428U patent/JPS6142853U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3703110A1 (en) * | 2014-03-04 | 2020-09-02 | Rohm Co., Ltd. | Semiconductor device and method of manufacturing semiconductor device |
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