WO2008108335A1 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- WO2008108335A1 WO2008108335A1 PCT/JP2008/053769 JP2008053769W WO2008108335A1 WO 2008108335 A1 WO2008108335 A1 WO 2008108335A1 JP 2008053769 W JP2008053769 W JP 2008053769W WO 2008108335 A1 WO2008108335 A1 WO 2008108335A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- dram
- semiconductor device
- logic lsi
- gpu
- bypassing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06589—Thermal management, e.g. cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/530,093 US8183686B2 (en) | 2007-03-06 | 2008-03-03 | Semiconductor device |
JP2009502573A JP5521546B2 (ja) | 2007-03-06 | 2008-03-03 | 半導体装置 |
US13/457,051 US8878358B2 (en) | 2007-03-06 | 2012-04-26 | Semiconductor device |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-055354 | 2007-03-06 | ||
JP2007055354 | 2007-03-06 | ||
JP2007-091082 | 2007-03-30 | ||
JP2007091082 | 2007-03-30 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/530,093 A-371-Of-International US8183686B2 (en) | 2007-03-06 | 2008-03-03 | Semiconductor device |
US13/457,051 Continuation US8878358B2 (en) | 2007-03-06 | 2012-04-26 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008108335A1 true WO2008108335A1 (ja) | 2008-09-12 |
Family
ID=39738212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/053769 WO2008108335A1 (ja) | 2007-03-06 | 2008-03-03 | 半導体装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US8183686B2 (ja) |
JP (1) | JP5521546B2 (ja) |
KR (1) | KR101477309B1 (ja) |
TW (1) | TWI456712B (ja) |
WO (1) | WO2008108335A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010109333A (ja) * | 2008-11-03 | 2010-05-13 | Headway Technologies Inc | ヒートシンクを備えた積層チップパッケージ |
CN103988296A (zh) * | 2011-11-14 | 2014-08-13 | 美光科技公司 | 具有多个热路径的堆叠半导体裸片组合件及相关联系统和方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9136202B2 (en) * | 2012-04-17 | 2015-09-15 | Qualcomm Incorporated | Enhanced package thermal management using external and internal capacitive thermal material |
CN104053337A (zh) * | 2013-03-15 | 2014-09-17 | 君瞻科技股份有限公司 | 具散热功能的电子装置及其散热模块 |
US10541229B2 (en) | 2015-02-19 | 2020-01-21 | Micron Technology, Inc. | Apparatuses and methods for semiconductor die heat dissipation |
US10008395B2 (en) * | 2016-10-19 | 2018-06-26 | Micron Technology, Inc. | Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill |
WO2023085672A1 (ko) * | 2021-11-12 | 2023-05-19 | 삼성전자주식회사 | 열 전도성 계면 물질을 수용하는 인쇄 회로 기판 구조체를 포함하는 전자 장치 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6336052U (ja) * | 1986-08-27 | 1988-03-08 | ||
JPH0878618A (ja) * | 1994-09-08 | 1996-03-22 | Fujitsu Ltd | マルチチップモジュール及びその製造方法 |
JPH0878616A (ja) * | 1994-09-02 | 1996-03-22 | Fujitsu Ltd | マルチチップ・モジュール |
JP2002110869A (ja) * | 2000-09-26 | 2002-04-12 | Toshiba Corp | 半導体装置 |
JP2005005529A (ja) * | 2003-06-12 | 2005-01-06 | Toshiba Corp | 三次元実装半導体モジュール及び三次元実装半導体システム |
JP2005166752A (ja) * | 2003-11-28 | 2005-06-23 | Ngk Spark Plug Co Ltd | 半導体部品の冷却装置及び冷却装置付き半導体部品 |
JP2006210892A (ja) * | 2004-12-27 | 2006-08-10 | Nec Corp | 半導体装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6336052A (ja) | 1986-07-30 | 1988-02-16 | Aisin Seiki Co Ltd | スタ−リング機関の高温熱交換器 |
JPH07235633A (ja) * | 1994-02-25 | 1995-09-05 | Fujitsu Ltd | マルチチップモジュール |
TW367436B (en) * | 1997-11-19 | 1999-08-21 | Sun Tai Lin | Heat pipes radiator |
US7271479B2 (en) * | 2004-11-03 | 2007-09-18 | Broadcom Corporation | Flip chip package including a non-planar heat spreader and method of making the same |
-
2008
- 2008-03-03 US US12/530,093 patent/US8183686B2/en active Active
- 2008-03-03 JP JP2009502573A patent/JP5521546B2/ja active Active
- 2008-03-03 KR KR1020097019047A patent/KR101477309B1/ko active IP Right Grant
- 2008-03-03 WO PCT/JP2008/053769 patent/WO2008108335A1/ja active Application Filing
- 2008-03-04 TW TW097107452A patent/TWI456712B/zh active
-
2012
- 2012-04-26 US US13/457,051 patent/US8878358B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6336052U (ja) * | 1986-08-27 | 1988-03-08 | ||
JPH0878616A (ja) * | 1994-09-02 | 1996-03-22 | Fujitsu Ltd | マルチチップ・モジュール |
JPH0878618A (ja) * | 1994-09-08 | 1996-03-22 | Fujitsu Ltd | マルチチップモジュール及びその製造方法 |
JP2002110869A (ja) * | 2000-09-26 | 2002-04-12 | Toshiba Corp | 半導体装置 |
JP2005005529A (ja) * | 2003-06-12 | 2005-01-06 | Toshiba Corp | 三次元実装半導体モジュール及び三次元実装半導体システム |
JP2005166752A (ja) * | 2003-11-28 | 2005-06-23 | Ngk Spark Plug Co Ltd | 半導体部品の冷却装置及び冷却装置付き半導体部品 |
JP2006210892A (ja) * | 2004-12-27 | 2006-08-10 | Nec Corp | 半導体装置 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010109333A (ja) * | 2008-11-03 | 2010-05-13 | Headway Technologies Inc | ヒートシンクを備えた積層チップパッケージ |
CN103988296A (zh) * | 2011-11-14 | 2014-08-13 | 美光科技公司 | 具有多个热路径的堆叠半导体裸片组合件及相关联系统和方法 |
JP2014533439A (ja) * | 2011-11-14 | 2014-12-11 | マイクロン テクノロジー, インク. | 複数の熱経路を備える積み重ねられた半導体ダイアセンブリ、ならびに関連するシステムおよび方法 |
JP2014533440A (ja) * | 2011-11-14 | 2014-12-11 | マイクロン テクノロジー, インク. | 温度管理強化型半導体ダイアセンブリ、それを含む半導体デバイスおよび関連方法 |
US9269646B2 (en) | 2011-11-14 | 2016-02-23 | Micron Technology, Inc. | Semiconductor die assemblies with enhanced thermal management and semiconductor devices including same |
US10170389B2 (en) | 2011-11-14 | 2019-01-01 | Micron Technology, Inc. | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods |
US10741468B2 (en) | 2011-11-14 | 2020-08-11 | Micron Technology, Inc. | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods |
US11594462B2 (en) | 2011-11-14 | 2023-02-28 | Micron Technology, Inc. | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods |
Also Published As
Publication number | Publication date |
---|---|
TW200839978A (en) | 2008-10-01 |
TWI456712B (zh) | 2014-10-11 |
US20100102441A1 (en) | 2010-04-29 |
US20120205792A1 (en) | 2012-08-16 |
KR20090119772A (ko) | 2009-11-19 |
US8183686B2 (en) | 2012-05-22 |
JP5521546B2 (ja) | 2014-06-18 |
KR101477309B1 (ko) | 2014-12-29 |
JPWO2008108335A1 (ja) | 2010-06-17 |
US8878358B2 (en) | 2014-11-04 |
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