JPS60141142U - 半導体装置の放熱フイン - Google Patents

半導体装置の放熱フイン

Info

Publication number
JPS60141142U
JPS60141142U JP1984028584U JP2858484U JPS60141142U JP S60141142 U JPS60141142 U JP S60141142U JP 1984028584 U JP1984028584 U JP 1984028584U JP 2858484 U JP2858484 U JP 2858484U JP S60141142 U JPS60141142 U JP S60141142U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation fins
semiconductor devices
semiconductor
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984028584U
Other languages
English (en)
Inventor
村竹　清
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP1984028584U priority Critical patent/JPS60141142U/ja
Publication of JPS60141142U publication Critical patent/JPS60141142U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の放熱器をＩＣに取付けた構成図、第２図
は従来の放熱器の放熱状態を示す構成図、第３図は本考
案の一実施例の放熱器をＩＣに　−取付けた断面図、第
４図は本考案の一実施例の放熱器の構成図、第５図は本
考案の放熱器の放熱状態を示す構成図、第６図は本考案
の他の実施例の放熱器をＩＣに取付けた断面図、第７図
は本考案の他の実施例の放熱器の構成図である。 ８、　１６−−−−−−放熱器、８ａ〜８ｄ、１６ａ〜
１６ｄ・・・・・・放熱フィン、１０・・・・・・ＩＣ
素子。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ＩＣ素子が搭載収容されたパッケージの該搭載部
    の裏面側に複数段５重ねられた放熱フィンを有する放熱
    器を有し、該放熱フィンの下面形状が逆載頭円錐形であ
    ることを特徴とする半導体装置の放熱フィン。
JP1984028584U 1984-02-29 1984-02-29 半導体装置の放熱フイン Pending JPS60141142U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984028584U JPS60141142U (ja) 1984-02-29 1984-02-29 半導体装置の放熱フイン

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984028584U JPS60141142U (ja) 1984-02-29 1984-02-29 半導体装置の放熱フイン

Publications (1)

Publication Number Publication Date
JPS60141142U true JPS60141142U (ja) 1985-09-18

Family

ID=30526598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984028584U Pending JPS60141142U (ja) 1984-02-29 1984-02-29 半導体装置の放熱フイン

Country Status (1)

Country Link
JP (1) JPS60141142U (ja)

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