JPS6387838U - - Google Patents
Info
- Publication number
- JPS6387838U JPS6387838U JP1986182428U JP18242886U JPS6387838U JP S6387838 U JPS6387838 U JP S6387838U JP 1986182428 U JP1986182428 U JP 1986182428U JP 18242886 U JP18242886 U JP 18242886U JP S6387838 U JPS6387838 U JP S6387838U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- die pad
- lead frame
- support member
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/5449—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986182428U JPS6387838U (enExample) | 1986-11-27 | 1986-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986182428U JPS6387838U (enExample) | 1986-11-27 | 1986-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6387838U true JPS6387838U (enExample) | 1988-06-08 |
Family
ID=31128220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986182428U Pending JPS6387838U (enExample) | 1986-11-27 | 1986-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6387838U (enExample) |
-
1986
- 1986-11-27 JP JP1986182428U patent/JPS6387838U/ja active Pending