JPS62163939U - - Google Patents

Info

Publication number
JPS62163939U
JPS62163939U JP1986052337U JP5233786U JPS62163939U JP S62163939 U JPS62163939 U JP S62163939U JP 1986052337 U JP1986052337 U JP 1986052337U JP 5233786 U JP5233786 U JP 5233786U JP S62163939 U JPS62163939 U JP S62163939U
Authority
JP
Japan
Prior art keywords
semiconductor element
element fixing
semiconductor
circuit board
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986052337U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986052337U priority Critical patent/JPS62163939U/ja
Publication of JPS62163939U publication Critical patent/JPS62163939U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP1986052337U 1986-04-08 1986-04-08 Pending JPS62163939U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986052337U JPS62163939U (enExample) 1986-04-08 1986-04-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986052337U JPS62163939U (enExample) 1986-04-08 1986-04-08

Publications (1)

Publication Number Publication Date
JPS62163939U true JPS62163939U (enExample) 1987-10-17

Family

ID=30877417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986052337U Pending JPS62163939U (enExample) 1986-04-08 1986-04-08

Country Status (1)

Country Link
JP (1) JPS62163939U (enExample)

Similar Documents

Publication Publication Date Title
JPS62163939U (enExample)
JPH0328742U (enExample)
JPH0214674U (enExample)
JPH028043U (enExample)
JPH0197501U (enExample)
JPH0339863U (enExample)
JPS62190342U (enExample)
JPS61121748U (enExample)
JPS6212948U (enExample)
JPS6221550U (enExample)
JPS6422089U (enExample)
JPH0317685U (enExample)
JPS6245868U (enExample)
JPS63132441U (enExample)
JPS6420738U (enExample)
JPH0256477U (enExample)
JPS61188362U (enExample)
JPS62184774U (enExample)
JPS6247171U (enExample)
JPS6387841U (enExample)
JPS62170632U (enExample)
JPH0265352U (enExample)
JPS62182579U (enExample)
JPS63180938U (enExample)
JPS6240844U (enExample)