JPH0741164Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0741164Y2 JPH0741164Y2 JP1989112645U JP11264589U JPH0741164Y2 JP H0741164 Y2 JPH0741164 Y2 JP H0741164Y2 JP 1989112645 U JP1989112645 U JP 1989112645U JP 11264589 U JP11264589 U JP 11264589U JP H0741164 Y2 JPH0741164 Y2 JP H0741164Y2
- Authority
- JP
- Japan
- Prior art keywords
- pellets
- lead frame
- lead frames
- transistor array
- land portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/5473—
-
- H10W90/756—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989112645U JPH0741164Y2 (ja) | 1989-09-26 | 1989-09-26 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989112645U JPH0741164Y2 (ja) | 1989-09-26 | 1989-09-26 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0351849U JPH0351849U (enExample) | 1991-05-20 |
| JPH0741164Y2 true JPH0741164Y2 (ja) | 1995-09-20 |
Family
ID=31661088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989112645U Expired - Lifetime JPH0741164Y2 (ja) | 1989-09-26 | 1989-09-26 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0741164Y2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103339724A (zh) * | 2011-02-09 | 2013-10-02 | 三菱电机株式会社 | 功率半导体模块 |
| US9888613B2 (en) | 2010-11-02 | 2018-02-06 | Mitsubishi Electric Corporation | Power module for electric power steering and electric power steering drive control apparatus using the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63151055A (ja) * | 1986-12-16 | 1988-06-23 | Matsushita Electronics Corp | 複合型半導体装置 |
| JPH0754841B2 (ja) * | 1987-04-13 | 1995-06-07 | サンケン電気株式会社 | 絶縁物封止型回路装置 |
-
1989
- 1989-09-26 JP JP1989112645U patent/JPH0741164Y2/ja not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9888613B2 (en) | 2010-11-02 | 2018-02-06 | Mitsubishi Electric Corporation | Power module for electric power steering and electric power steering drive control apparatus using the same |
| CN103339724A (zh) * | 2011-02-09 | 2013-10-02 | 三菱电机株式会社 | 功率半导体模块 |
| CN103339724B (zh) * | 2011-02-09 | 2016-03-02 | 三菱电机株式会社 | 功率半导体模块 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0351849U (enExample) | 1991-05-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0399447B1 (en) | Plastic molded type semiconductor device | |
| US6841858B2 (en) | Leadframe for die stacking applications and related die stacking concepts | |
| US3283224A (en) | Mold capping semiconductor device | |
| JP5523769B2 (ja) | 熱電モジュール | |
| US6703691B2 (en) | Quad flat non-leaded semiconductor package and method of fabricating the same | |
| US7141867B2 (en) | Quad flat non-leaded package | |
| US4278991A (en) | IC Package with heat sink and minimal cross-sectional area | |
| JPH0741164Y2 (ja) | 半導体装置 | |
| KR101652423B1 (ko) | 핑거 클립 본딩 반도체 패키지 | |
| US3723833A (en) | Heat sinking of semiconductor integrated circuit devices | |
| JPS63293928A (ja) | 電子装置 | |
| JP2005159238A (ja) | 半導体装置 | |
| US3679946A (en) | Strip mounted semiconductor device | |
| JPS6329413B2 (enExample) | ||
| KR100723379B1 (ko) | 일체형 타이 바를 구비한 loc 패키지 | |
| JPS6344298B2 (enExample) | ||
| JPH06244334A (ja) | 樹脂封止型半導体装置 | |
| KR0124827Y1 (ko) | 기판실장형 반도체 패키지 | |
| CN114823643A (zh) | 封装半导体器件 | |
| JPH0357259A (ja) | 半導体装置 | |
| JPH07202097A (ja) | 半導体装置及びリードフレーム | |
| JPS5979536A (ja) | 樹脂封止型半導体装置 | |
| JPS62183191A (ja) | 半導体素子用ヘツダ | |
| JPH0637210A (ja) | 半導体装置とその製造方法 | |
| JPS59107554A (ja) | 半導体モジユ−ル |