JPH0224547U - - Google Patents
Info
- Publication number
- JPH0224547U JPH0224547U JP1988101470U JP10147088U JPH0224547U JP H0224547 U JPH0224547 U JP H0224547U JP 1988101470 U JP1988101470 U JP 1988101470U JP 10147088 U JP10147088 U JP 10147088U JP H0224547 U JPH0224547 U JP H0224547U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pads
- semiconductor chip
- chip
- pads
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W72/07554—
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- H10W72/5445—
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- H10W72/547—
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- H10W72/932—
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- H10W72/9445—
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- H10W74/00—
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- H10W90/732—
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- H10W90/752—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988101470U JPH0224547U (enExample) | 1988-07-30 | 1988-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988101470U JPH0224547U (enExample) | 1988-07-30 | 1988-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0224547U true JPH0224547U (enExample) | 1990-02-19 |
Family
ID=31330496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988101470U Pending JPH0224547U (enExample) | 1988-07-30 | 1988-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0224547U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0364934A (ja) * | 1989-08-02 | 1991-03-20 | Nec Corp | 樹脂封止型半導体装置 |
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1988
- 1988-07-30 JP JP1988101470U patent/JPH0224547U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0364934A (ja) * | 1989-08-02 | 1991-03-20 | Nec Corp | 樹脂封止型半導体装置 |