JPH0224552U - - Google Patents
Info
- Publication number
- JPH0224552U JPH0224552U JP1988101228U JP10122888U JPH0224552U JP H0224552 U JPH0224552 U JP H0224552U JP 1988101228 U JP1988101228 U JP 1988101228U JP 10122888 U JP10122888 U JP 10122888U JP H0224552 U JPH0224552 U JP H0224552U
- Authority
- JP
- Japan
- Prior art keywords
- package body
- cap
- package
- opening
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988101228U JPH0224552U (enExample) | 1988-07-30 | 1988-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988101228U JPH0224552U (enExample) | 1988-07-30 | 1988-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0224552U true JPH0224552U (enExample) | 1990-02-19 |
Family
ID=31330032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988101228U Pending JPH0224552U (enExample) | 1988-07-30 | 1988-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0224552U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015204426A (ja) * | 2014-04-16 | 2015-11-16 | Ｎｇｋエレクトロデバイス株式会社 | 電子部品収納用パッケージ |
| US11227850B2 (en) | 2020-03-17 | 2022-01-18 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing the same |
-
1988
- 1988-07-30 JP JP1988101228U patent/JPH0224552U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015204426A (ja) * | 2014-04-16 | 2015-11-16 | Ｎｇｋエレクトロデバイス株式会社 | 電子部品収納用パッケージ |
| US11227850B2 (en) | 2020-03-17 | 2022-01-18 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing the same |