JPH0224552U - - Google Patents

Info

Publication number
JPH0224552U
JPH0224552U JP1988101228U JP10122888U JPH0224552U JP H0224552 U JPH0224552 U JP H0224552U JP 1988101228 U JP1988101228 U JP 1988101228U JP 10122888 U JP10122888 U JP 10122888U JP H0224552 U JPH0224552 U JP H0224552U
Authority
JP
Japan
Prior art keywords
package body
cap
package
opening
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988101228U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988101228U priority Critical patent/JPH0224552U/ja
Publication of JPH0224552U publication Critical patent/JPH0224552U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の全体断面図、第２
図は他の実施例の要部の拡大断面図、第３図は異
なる他の実施例の要部の拡大断面図、第４図は従
来のパツケージ構造の全体断面図である。 １……パツケージ本体、１ａ……段部、１ｂ…
…凹部、２……内部リード、３……外部リード、
４……半導体素子、５……金属細線、６……キヤ
ツプ、６ａ……段部、７……半田。

Claims (1)

    【実用新案登録請求の範囲】
  1. パツケージ本体の開口部にキヤツプを半田付け
    してパツケージ本体内部を気密封止するパツケー
    ジ構造において、前記パツケージ本体とキヤツプ
    との間には、パツケージ本体の開口部に沿つて半
    田を溜めることができる溝を形成したことを特徴
    とする気密封止パツケージ構造。
JP1988101228U 1988-07-30 1988-07-30 Pending JPH0224552U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988101228U JPH0224552U (ja) 1988-07-30 1988-07-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988101228U JPH0224552U (ja) 1988-07-30 1988-07-30

Publications (1)

Publication Number Publication Date
JPH0224552U true JPH0224552U (ja) 1990-02-19

Family

ID=31330032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988101228U Pending JPH0224552U (ja) 1988-07-30 1988-07-30

Country Status (1)

Country Link
JP (1) JPH0224552U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015204426A (ja) * 2014-04-16 2015-11-16 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージ
US11227850B2 (en) 2020-03-17 2022-01-18 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015204426A (ja) * 2014-04-16 2015-11-16 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージ
US11227850B2 (en) 2020-03-17 2022-01-18 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same

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