JPH0288243U - - Google Patents
Info
- Publication number
- JPH0288243U JPH0288243U JP1988167203U JP16720388U JPH0288243U JP H0288243 U JPH0288243 U JP H0288243U JP 1988167203 U JP1988167203 U JP 1988167203U JP 16720388 U JP16720388 U JP 16720388U JP H0288243 U JPH0288243 U JP H0288243U
- Authority
- JP
- Japan
- Prior art keywords
- package
- fixed
- mounting material
- integrated circuit
- circuit chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/30—
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- H10W70/682—
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- H10W72/884—
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- H10W72/931—
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- H10W74/00—
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- H10W90/734—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988167203U JPH0288243U (enExample) | 1988-12-23 | 1988-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988167203U JPH0288243U (enExample) | 1988-12-23 | 1988-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0288243U true JPH0288243U (enExample) | 1990-07-12 |
Family
ID=31455285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988167203U Pending JPH0288243U (enExample) | 1988-12-23 | 1988-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0288243U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016103520A (ja) * | 2014-11-27 | 2016-06-02 | 京セラ株式会社 | 電子部品実装用パッケージおよび電子装置 |
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1988
- 1988-12-23 JP JP1988167203U patent/JPH0288243U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016103520A (ja) * | 2014-11-27 | 2016-06-02 | 京セラ株式会社 | 電子部品実装用パッケージおよび電子装置 |