JPS62178532U - - Google Patents

Info

Publication number
JPS62178532U
JPS62178532U JP1986066644U JP6664486U JPS62178532U JP S62178532 U JPS62178532 U JP S62178532U JP 1986066644 U JP1986066644 U JP 1986066644U JP 6664486 U JP6664486 U JP 6664486U JP S62178532 U JPS62178532 U JP S62178532U
Authority
JP
Japan
Prior art keywords
island
semiconductor chip
lead frame
back surface
resin adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986066644U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986066644U priority Critical patent/JPS62178532U/ja
Publication of JPS62178532U publication Critical patent/JPS62178532U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1986066644U 1986-04-30 1986-04-30 Pending JPS62178532U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986066644U JPS62178532U (enExample) 1986-04-30 1986-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986066644U JPS62178532U (enExample) 1986-04-30 1986-04-30

Publications (1)

Publication Number Publication Date
JPS62178532U true JPS62178532U (enExample) 1987-11-12

Family

ID=30904842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986066644U Pending JPS62178532U (enExample) 1986-04-30 1986-04-30

Country Status (1)

Country Link
JP (1) JPS62178532U (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229561A (ja) * 2012-03-30 2013-11-07 Mitsubishi Materials Corp 接合体の製造方法、パワーモジュールの製造方法、パワーモジュール用基板及びパワーモジュール
JP2014022576A (ja) * 2012-07-18 2014-02-03 Nichia Chem Ind Ltd 半導体素子実装部材及び半導体装置
JP2016184756A (ja) * 2016-06-10 2016-10-20 日亜化学工業株式会社 半導体素子実装部材及び半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54122088A (en) * 1978-03-15 1979-09-21 Mitsubishi Electric Corp Metal substrate for semiconductor-pellet mounting
JPS5852863A (ja) * 1981-09-25 1983-03-29 Toshiba Corp 半導体装置用リ−ドフレ−ム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54122088A (en) * 1978-03-15 1979-09-21 Mitsubishi Electric Corp Metal substrate for semiconductor-pellet mounting
JPS5852863A (ja) * 1981-09-25 1983-03-29 Toshiba Corp 半導体装置用リ−ドフレ−ム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229561A (ja) * 2012-03-30 2013-11-07 Mitsubishi Materials Corp 接合体の製造方法、パワーモジュールの製造方法、パワーモジュール用基板及びパワーモジュール
JP2014022576A (ja) * 2012-07-18 2014-02-03 Nichia Chem Ind Ltd 半導体素子実装部材及び半導体装置
JP2016184756A (ja) * 2016-06-10 2016-10-20 日亜化学工業株式会社 半導体素子実装部材及び半導体装置

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