JPS62178532U - - Google Patents
Info
- Publication number
- JPS62178532U JPS62178532U JP1986066644U JP6664486U JPS62178532U JP S62178532 U JPS62178532 U JP S62178532U JP 1986066644 U JP1986066644 U JP 1986066644U JP 6664486 U JP6664486 U JP 6664486U JP S62178532 U JPS62178532 U JP S62178532U
- Authority
- JP
- Japan
- Prior art keywords
- island
- semiconductor chip
- lead frame
- back surface
- resin adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W70/681—
-
- H10W72/07353—
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- H10W72/334—
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- H10W72/931—
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- H10W90/736—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986066644U JPS62178532U (enExample) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986066644U JPS62178532U (enExample) | 1986-04-30 | 1986-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62178532U true JPS62178532U (enExample) | 1987-11-12 |
Family
ID=30904842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986066644U Pending JPS62178532U (enExample) | 1986-04-30 | 1986-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62178532U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013229561A (ja) * | 2012-03-30 | 2013-11-07 | Mitsubishi Materials Corp | 接合体の製造方法、パワーモジュールの製造方法、パワーモジュール用基板及びパワーモジュール |
| JP2014022576A (ja) * | 2012-07-18 | 2014-02-03 | Nichia Chem Ind Ltd | 半導体素子実装部材及び半導体装置 |
| JP2016184756A (ja) * | 2016-06-10 | 2016-10-20 | 日亜化学工業株式会社 | 半導体素子実装部材及び半導体装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54122088A (en) * | 1978-03-15 | 1979-09-21 | Mitsubishi Electric Corp | Metal substrate for semiconductor-pellet mounting |
| JPS5852863A (ja) * | 1981-09-25 | 1983-03-29 | Toshiba Corp | 半導体装置用リ−ドフレ−ム |
-
1986
- 1986-04-30 JP JP1986066644U patent/JPS62178532U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54122088A (en) * | 1978-03-15 | 1979-09-21 | Mitsubishi Electric Corp | Metal substrate for semiconductor-pellet mounting |
| JPS5852863A (ja) * | 1981-09-25 | 1983-03-29 | Toshiba Corp | 半導体装置用リ−ドフレ−ム |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013229561A (ja) * | 2012-03-30 | 2013-11-07 | Mitsubishi Materials Corp | 接合体の製造方法、パワーモジュールの製造方法、パワーモジュール用基板及びパワーモジュール |
| JP2014022576A (ja) * | 2012-07-18 | 2014-02-03 | Nichia Chem Ind Ltd | 半導体素子実装部材及び半導体装置 |
| JP2016184756A (ja) * | 2016-06-10 | 2016-10-20 | 日亜化学工業株式会社 | 半導体素子実装部材及び半導体装置 |