JPH02127038U - - Google Patents
Info
- Publication number
- JPH02127038U JPH02127038U JP1989036061U JP3606189U JPH02127038U JP H02127038 U JPH02127038 U JP H02127038U JP 1989036061 U JP1989036061 U JP 1989036061U JP 3606189 U JP3606189 U JP 3606189U JP H02127038 U JPH02127038 U JP H02127038U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base
- lid
- semiconductor chip
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W76/63—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989036061U JPH02127038U (enExample) | 1989-03-28 | 1989-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989036061U JPH02127038U (enExample) | 1989-03-28 | 1989-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02127038U true JPH02127038U (enExample) | 1990-10-19 |
Family
ID=31541965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989036061U Pending JPH02127038U (enExample) | 1989-03-28 | 1989-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02127038U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011205270A (ja) * | 2010-03-25 | 2011-10-13 | Nippon Dempa Kogyo Co Ltd | 圧電デバイス |
-
1989
- 1989-03-28 JP JP1989036061U patent/JPH02127038U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011205270A (ja) * | 2010-03-25 | 2011-10-13 | Nippon Dempa Kogyo Co Ltd | 圧電デバイス |
| US8624470B2 (en) | 2010-03-25 | 2014-01-07 | Nihon Dempa Kogyo Co., Ltd. | Piezoelectric devices including electrode-less vibrating portions |