JPH0392053U - - Google Patents
Info
- Publication number
- JPH0392053U JPH0392053U JP1990000719U JP71990U JPH0392053U JP H0392053 U JPH0392053 U JP H0392053U JP 1990000719 U JP1990000719 U JP 1990000719U JP 71990 U JP71990 U JP 71990U JP H0392053 U JPH0392053 U JP H0392053U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- chip
- stage
- resin
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990000719U JPH0392053U (enExample) | 1990-01-09 | 1990-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990000719U JPH0392053U (enExample) | 1990-01-09 | 1990-01-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0392053U true JPH0392053U (enExample) | 1991-09-19 |
Family
ID=31504660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990000719U Pending JPH0392053U (enExample) | 1990-01-09 | 1990-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0392053U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007164741A (ja) * | 2005-12-12 | 2007-06-28 | Figla Co Ltd | 建築現場の管理システム |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6482554A (en) * | 1987-09-24 | 1989-03-28 | Mitsubishi Electric Corp | Resin-sealed semiconductor device |
-
1990
- 1990-01-09 JP JP1990000719U patent/JPH0392053U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6482554A (en) * | 1987-09-24 | 1989-03-28 | Mitsubishi Electric Corp | Resin-sealed semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007164741A (ja) * | 2005-12-12 | 2007-06-28 | Figla Co Ltd | 建築現場の管理システム |