JPH01107143U - - Google Patents
Info
- Publication number
- JPH01107143U JPH01107143U JP1988000551U JP55188U JPH01107143U JP H01107143 U JPH01107143 U JP H01107143U JP 1988000551 U JP1988000551 U JP 1988000551U JP 55188 U JP55188 U JP 55188U JP H01107143 U JPH01107143 U JP H01107143U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor chip
- sealing
- island
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W70/682—
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- H10W72/536—
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- H10W72/5363—
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- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988000551U JPH01107143U (enExample) | 1988-01-08 | 1988-01-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988000551U JPH01107143U (enExample) | 1988-01-08 | 1988-01-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01107143U true JPH01107143U (enExample) | 1989-07-19 |
Family
ID=31199682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988000551U Pending JPH01107143U (enExample) | 1988-01-08 | 1988-01-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01107143U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2021186657A1 (enExample) * | 2020-03-19 | 2021-09-23 |
-
1988
- 1988-01-08 JP JP1988000551U patent/JPH01107143U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2021186657A1 (enExample) * | 2020-03-19 | 2021-09-23 | ||
| WO2021186657A1 (ja) * | 2020-03-19 | 2021-09-23 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| US12334408B2 (en) | 2020-03-19 | 2025-06-17 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing semiconductor device |