JPS63195729U - - Google Patents
Info
- Publication number
- JPS63195729U JPS63195729U JP1987087306U JP8730687U JPS63195729U JP S63195729 U JPS63195729 U JP S63195729U JP 1987087306 U JP1987087306 U JP 1987087306U JP 8730687 U JP8730687 U JP 8730687U JP S63195729 U JPS63195729 U JP S63195729U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- bonding pad
- pad portion
- lead
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W72/07551—
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- H10W72/50—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/59—
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- H10W72/934—
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- H10W72/983—
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- H10W74/00—
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- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987087306U JPS63195729U (enExample) | 1987-06-05 | 1987-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987087306U JPS63195729U (enExample) | 1987-06-05 | 1987-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63195729U true JPS63195729U (enExample) | 1988-12-16 |
Family
ID=30944390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987087306U Pending JPS63195729U (enExample) | 1987-06-05 | 1987-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63195729U (enExample) |
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1987
- 1987-06-05 JP JP1987087306U patent/JPS63195729U/ja active Pending