JPH0275736U - - Google Patents
Info
- Publication number
- JPH0275736U JPH0275736U JP1988155704U JP15570488U JPH0275736U JP H0275736 U JPH0275736 U JP H0275736U JP 1988155704 U JP1988155704 U JP 1988155704U JP 15570488 U JP15570488 U JP 15570488U JP H0275736 U JPH0275736 U JP H0275736U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- bonding wire
- external terminal
- electrical connection
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/50—
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- H10W72/01515—
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- H10W72/075—
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- H10W72/07551—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/884—
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- H10W74/00—
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- H10W90/734—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988155704U JPH0275736U (enExample) | 1988-11-29 | 1988-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988155704U JPH0275736U (enExample) | 1988-11-29 | 1988-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0275736U true JPH0275736U (enExample) | 1990-06-11 |
Family
ID=31433572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988155704U Pending JPH0275736U (enExample) | 1988-11-29 | 1988-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0275736U (enExample) |
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1988
- 1988-11-29 JP JP1988155704U patent/JPH0275736U/ja active Pending