JPH0298649U - - Google Patents
Info
- Publication number
- JPH0298649U JPH0298649U JP1989007882U JP788289U JPH0298649U JP H0298649 U JPH0298649 U JP H0298649U JP 1989007882 U JP1989007882 U JP 1989007882U JP 788289 U JP788289 U JP 788289U JP H0298649 U JPH0298649 U JP H0298649U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- semiconductor element
- package resin
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989007882U JPH0298649U (enExample) | 1989-01-26 | 1989-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989007882U JPH0298649U (enExample) | 1989-01-26 | 1989-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0298649U true JPH0298649U (enExample) | 1990-08-06 |
Family
ID=31213279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989007882U Pending JPH0298649U (enExample) | 1989-01-26 | 1989-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0298649U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023136074A1 (ja) * | 2022-01-13 | 2023-07-20 | ローム株式会社 | 半導体装置 |
-
1989
- 1989-01-26 JP JP1989007882U patent/JPH0298649U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023136074A1 (ja) * | 2022-01-13 | 2023-07-20 | ローム株式会社 | 半導体装置 |