JPH0328727U - - Google Patents
Info
- Publication number
- JPH0328727U JPH0328727U JP1989089405U JP8940589U JPH0328727U JP H0328727 U JPH0328727 U JP H0328727U JP 1989089405 U JP1989089405 U JP 1989089405U JP 8940589 U JP8940589 U JP 8940589U JP H0328727 U JPH0328727 U JP H0328727U
- Authority
- JP
- Japan
- Prior art keywords
- bonded
- pin head
- substrate
- semiconductor device
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/0711—
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- H10W72/07141—
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- H10W72/075—
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- H10W72/07521—
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- H10W72/07551—
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- H10W72/50—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/931—
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- H10W90/753—
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- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989089405U JPH0328727U (enExample) | 1989-07-29 | 1989-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989089405U JPH0328727U (enExample) | 1989-07-29 | 1989-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0328727U true JPH0328727U (enExample) | 1991-03-22 |
Family
ID=31638984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989089405U Pending JPH0328727U (enExample) | 1989-07-29 | 1989-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328727U (enExample) |
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1989
- 1989-07-29 JP JP1989089405U patent/JPH0328727U/ja active Pending