JPH0192134U - - Google Patents
Info
- Publication number
- JPH0192134U JPH0192134U JP1987186446U JP18644687U JPH0192134U JP H0192134 U JPH0192134 U JP H0192134U JP 1987186446 U JP1987186446 U JP 1987186446U JP 18644687 U JP18644687 U JP 18644687U JP H0192134 U JPH0192134 U JP H0192134U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- semiconductor
- semiconductor device
- bump
- semiconductor chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W70/682—
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- H10W72/536—
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- H10W72/5363—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987186446U JPH0192134U (enExample) | 1987-12-09 | 1987-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987186446U JPH0192134U (enExample) | 1987-12-09 | 1987-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0192134U true JPH0192134U (enExample) | 1989-06-16 |
Family
ID=31477674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987186446U Pending JPH0192134U (enExample) | 1987-12-09 | 1987-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0192134U (enExample) |
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1987
- 1987-12-09 JP JP1987186446U patent/JPH0192134U/ja active Pending