JPH0167747U - - Google Patents
Info
- Publication number
- JPH0167747U JPH0167747U JP1987161792U JP16179287U JPH0167747U JP H0167747 U JPH0167747 U JP H0167747U JP 1987161792 U JP1987161792 U JP 1987161792U JP 16179287 U JP16179287 U JP 16179287U JP H0167747 U JPH0167747 U JP H0167747U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- substrate
- bump
- recess
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/724—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161792U JPH0167747U (enExample) | 1987-10-22 | 1987-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161792U JPH0167747U (enExample) | 1987-10-22 | 1987-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167747U true JPH0167747U (enExample) | 1989-05-01 |
Family
ID=31445039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987161792U Pending JPH0167747U (enExample) | 1987-10-22 | 1987-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167747U (enExample) |
-
1987
- 1987-10-22 JP JP1987161792U patent/JPH0167747U/ja active Pending